Fingerprint sensor package and display apparatus including the same

ABSTRACT

Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. nonprovisional application is a continuation of U.S. patentapplication Ser. No. 16/027,620, filed Jul. 5, 2018, in the U.S. Patentand Trademark Office, which claims the benefit of priority under 35U.S.C. § 119 to Korean Patent Application No. 10-2018-0003774, filed onJan. 11, 2018, in the Korean Intellectual Property Office, the entirecontents of both of which are hereby incorporated by reference.

BACKGROUND

The disclosed concepts relate to a sensor package and a displayapparatus including the same, and more particularly, to a fingerprintsensor package and a display apparatus including the same.

A fingerprint sensor is a recognition sensor for human fingerprints, andwidely used on door locks, mobile phones, and the like. The fingerprintsensor can be broadly categorized into optical-type, capacitive-type,and ultrasonic-type sensors, depending on an operating principlethereof. To be suitable for mobile devices, such as cellular phones,fingerprint sensor packages are compact and thin.

SUMMARY

Some embodiments provide a fingerprint sensor package that is reduced insize and thickness and a display apparatus including the same.

Some embodiments provide a fingerprint sensor package that is reduced innumber of components and a display apparatus including the same.

According the exemplary embodiments, the disclosure is directed to afingerprint sensor package, comprising: a flexible film having a topsurface and a bottom surface opposite to the top surface; a fingerprintsensor; and a display driver integrated circuit on the flexible film,wherein the fingerprint sensor and the display driver integrated circuitare mounted on the top surface of the flexible film.

According the exemplary embodiments, the disclosure is directed to adisplay apparatus, comprising: a display panel; and a fingerprint sensorpackage below the display panel, wherein the fingerprint sensor packagecomprises: a flexible film; a fingerprint sensor; a display driverintegrated circuit configured to drive the display panel; and active andpassive devices, wherein the flexible film comprises a top surfacefacing the display panel and a bottom surface opposite to the topsurface, and wherein the fingerprint sensor, the display driverintegrated circuit, and the active and passive devices are provided onthe top surface of the flexible film.

According the exemplary embodiments, the disclosure is directed to adisplay apparatus, comprising: an organic light emitting diode (OLED)display panel; and a fingerprint sensor package below the OLED displaypanel, wherein the fingerprint sensor package comprises: a flexible filmelectrically connected to the OLED display panel, the flexible filmhaving a top surface facing the OLED display panel and a bottom surfaceopposite to the top surface; a fingerprint sensor on the top surface ofthe flexible film; a display driver integrated circuit on the topsurface of the flexible film and configured to drive the OLED displaypanel; a semiconductor memory device on the top surface of the flexiblefilm; and a passive device on the top surface of the flexible film.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross-sectional view showing a display apparatusincluding a fingerprint sensor package, according to exemplaryembodiments.

FIG. 1B illustrates a cross-sectional view showing a fingerprintrecognition operation of a fingerprint sensor package, according toexemplary embodiments.

FIG. 2A illustrates a cross-sectional view showing a display apparatusincluding a fingerprint sensor package, according to exemplaryembodiments.

FIG. 2B illustrates a cross-sectional view showing a fingerprintrecognition operation of a fingerprint sensor package, according toexemplary embodiments.

FIG. 2C illustrates a cross-sectional view showing a display apparatusincluding a fingerprint sensor package, according to exemplaryembodiments.

FIG. 3 illustrates a perspective view showing an application example ofa display apparatus including a fingerprint sensor package, according toexemplary embodiments.

DETAILED DESCRIPTION

A fingerprint sensor package and a display apparatus including the sameaccording to exemplary embodiments will be discussed hereinafter indetail with reference to the accompanying drawings.

FIG. 1A illustrates a cross-sectional view showing a display apparatusincluding a fingerprint sensor package, according to exemplaryembodiments.

Referring to FIG. 1A, a display apparatus 1 may include a display panel120 and a fingerprint sensor package 100 electrically connected to thedisplay panel 120. The fingerprint sensor package 100 may be providedbelow the display panel 120. For example, the fingerprint sensor package100 may be electrically connected to a top surface 120 a of the displaypanel 120, and extend to a region below the display panel 120. Thedisplay panel 120 may be or may include an organic light emitting diode(OLED) type display panel. For example, the display panel 120 mayinclude an organic layer 122 in which arranged are a plurality ofred-colored light emitting layers 122 a, a plurality of green-coloredlight emitting layers 122 b, and a plurality of blue-colored lightemitting layers 122 c. The organic layer 122 may give off or emitauto-luminescent light that is discharged upward from a top surface 120a of the display panel 120. The display apparatus 1 may further includea main board 130 electrically connected to the fingerprint sensorpackage 100.

The fingerprint sensor package 100 may include a flexible film 101consisting of a polymeric material such as polyimide, a fingerprintsensor 105 to recognize fingerprints, and a display driver integratedcircuit (e.g., formed as a semiconductor chip) (DDI) 103 to drive thedisplay panel 120. The fingerprint sensor package 100 may furtherinclude a semiconductor memory device (e.g. chip) 111 storing datarequired to operate the display panel 120, a passive device 109 such ascapacitor, resistor, and inductor, an infrared cut filter 113 providedabove the fingerprint sensor 105, and a stiffener 115 provided below thefingerprint sensor 105.

The fingerprint sensor 105 may be wire-bonded to the flexible film 101,and the semiconductor memory device 111 and the DDI 103 may be flip-chipbonded to the flexible film 101. Alternatively, the fingerprint sensor105 may be flip-chip bonded to the flexible film 101, and thesemiconductor memory device 111 and the DDI 103 may be wire-bonded tothe flexible film 101. Dissimilarly, the fingerprint sensor 105, thesemiconductor memory device 111, and the DDI 103 may all be eitherwire-bonded or flip-chip bonded to the flexible film 101.

The fingerprint sensor 105 may include an image sensor (e.g., as CMOSimage sensor semiconductor device or chip) having a plurality ofmicro-lenses 105 a. The fingerprint sensor 105 may be surrounded by acap 107 having an opening 107 a that is opened between the fingerprintsensor 105 and the display panel 120. The opening 107 a may have arectangular, circular, or polygonal shape in a plan view. The cap 107may have an L-shaped cross-section that surrounds a lateral surface ofthe fingerprint sensor 105 and partially covers a top surface of thefingerprint sensor 105, thereby providing a protective cover for sideand top surfaces of the fingerprint sensor 105. The opening 107 a mayexpose the micro-lenses 105 a of the fingerprint sensor 105. The cap 107may include a metallic material (e.g., stainless steel) or a relativelystiff insulating material (e.g., polymer).

The infrared cut filter 113 may be provided between the fingerprintsensor 105 and the display panel 120, while vertically overlapping thefingerprint sensor 105. The infrared cut filter 113 may be rigidlyadhered onto a bottom surface 120 b of the display panel 120. Anadhesive layer 116 may be provided between the cap 107 and the infraredcut filter 113.

The fingerprint sensor 105, the DDI 103, the semiconductor memory device111, and one or more passive devices 109 (e.g., capacitors, resistors,and inductors) may be mounted on a top surface 101 a of the flexiblefilm 101. Although not shown in figures, the flexible film 101 mayinclude therein electrical wiring lines that consist of metal such ascopper. Some or all of the fingerprint sensor 105, the DDI 103, thesemiconductor memory device 111, and the passive device 109 may beelectrically connected with one another through the electrical wiringlines within the flexible film 101. In addition, the electrical wiringlines may electrically connect a first end of the flexible film 101 tothe display panel 120 and also electrically connect a second end of theflexible film 101, which is opposite to the first end, to the main board130. The display panel 120 and the main board 130 may include electricalwiring lines coupled to the electrical wiring lines of the flexible film101. For example, the flexible film may include conductive patternsformed thereon (not shown), including bonding pads to connect to thedevices formed thereon (e.g., the fingerprint sensor 105, thesemiconductor memory device 111, the DDI 103 and passive devices 109,etc.) and the electrical wiring extending between bonding pads tointerconnect these devices. For example, the electrical wiring mayinterconnect the DDI 103 to the main board 130 to provide image data(e.g., a plurality of pixel data values) from the main board 130 to theDDI 103. Also, the electrical wiring may interconnect the DDI 103 to thedisplay panel 120 to provide driving signals from DDI 103 to the displaypanel 120 to drive the display of the display panel 120 (e.g., switchpixels of the display according to the pixel data received from the mainboard 130).

The stiffener 115 may be provided on a bottom surface 101 b of theflexible film 101, while vertically overlapping the fingerprint sensor105. For example, the stiffener 115 may be provided below thefingerprint sensor 105 to provide support for the fingerprint sensor105. The stiffener 115 may include a metallic material such as stainlesssteel or a stiff insulating material. The stiffener 115 may rigidlysupport the flexible film 101 when the fingerprint sensor 105 iswire-bonded to the flexible film 101. The flexible film 101 may beconfigured such that the top surface 101 a faces the display panel 120and the bottom surface 101 b is opposite to the top surface 110 a andfaces away from the display panel 120.

In some embodiments, the flexible film 101 may be packaged with activedevices (e.g., the fingerprint sensor 105, the DDI 103, and thesemiconductor memory device 111) and with the passive devices 109 (e.g.,capacitors, resistors, and inductors). For example, a separate FPCB(flexible print circuit board) may not be required to mount thereon thefingerprint sensor 105, the semiconductor memory device 111, and thepassive devices 109. The active devices 103, 105, and 111 and thepassive devices 109 may be mounted on the flexible film 101 in areel-to-reel manner.

As discussed above, the flexible film 101 may be mounted thereon notonly with the DDI 103, but also with all of the passive devices 109 andthe active devices, such as the fingerprint sensor 105 and thesemiconductor memory device 111. The fingerprint sensor package 100 andthe display apparatus 1 including the same may then achieve a decreasein the number of components, improvement in the degree of designfreedom, reduction in cost, thinness and compactness in size, andsimplification in supply chain management of components.

FIG. 1B illustrates a cross-sectional view showing a fingerprintrecognition operation of a fingerprint sensor package, according toexemplary embodiments.

Referring to FIG. 1B, a fingerprint cognition target 140, such as humanfingerprint, may be provided on the top surface 120 a of the displaypanel 120. When the target 140 is provided on the top surface 120 a ofthe display panel 120, a light (represented by solid arrows) emittedfrom the organic layer 122 toward the target 140 may be reflected on thetarget 140 and then travel toward the fingerprint sensor 105. The lightreflected on the target 140 may be filtered through the infrared cutfilter 113 and then detected on the fingerprint sensor 105 after passingthrough the opening 107 a. For example, the fingerprint sensor 105 mayselectively detect infrared-filtered visible light of the light emittedfrom the organic layer 122 and reflect on the target 140. Thefingerprint sensor package 100 may accordingly perform fingerprintrecognition based on the selectively detected infrared-filtered visiblelight.

FIG. 2A illustrates a cross-sectional view showing a display apparatusincluding a fingerprint sensor package, according to exemplaryembodiments. FIG. 2B illustrates a cross-sectional view showing afingerprint recognition operation of a fingerprint sensor packageaccording to exemplary embodiments. FIG. 2C illustrates across-sectional view showing a display apparatus including a fingerprintsensor package, according to exemplary embodiments. In the embodimentsthat follow, explanations repetitive to those discussed above withreference to FIGS. 1A and 1B will be omitted or abridged in the interestof brevity of description.

Referring to FIG. 2A, a display apparatus 2 may include a display panel120 such as an organic light emitting diode (OLED) type display paneland a fingerprint sensor package 100 including a flexible film 101electrically connected to the display panel 120. The flexible film 101may have a top surface 101 a mounted thereon with active devices such asa fingerprint sensor 105, a display driver integrated circuit (DDI) 103,and a semiconductor memory device 111 and with one or more passivedevices 109 (e.g., capacitors, resistors, and inductors). The flexiblefilm 101 may have a bottom surface 101 b on which a stiffener 115 isprovided.

In some embodiments, the fingerprint sensor 105 may include nomicro-lenses 105 a of FIG. 1A. A cap 107 surrounding the fingerprintsensor 105 may have a plurality of pin holes 107 b that are openedbetween the fingerprint sensor 105 and the display panel 120. The pinholes 107 b may be regularly or irregularly arranged to have arectangular, circular, or polygonal shape in a plan view. Alternatively,as illustrated in FIG. 2C, the fingerprint sensor 105 may furtherinclude both pin holes 107 b and a plurality of micro-lenses 105 a.

Referring to FIG. 2B, when a target 140 is provided on a top surface 120a of the display panel 120, a light emitted from an organic layer 122may be reflected on the target 140. Some of the reflected light may passthrough the pin hole 107 b (represented by the solid arrow), and othersof the reflected light may not pass through the pin hole 107 b(represented by the dotted arrow). The fingerprint sensor 105 mayreceive the light (represented by the solid arrow) passing through thepin hole 107 b, thereby performing fingerprint recognition based on thelight passing through the pin hole 107 b. The principle of thefingerprint recognition may hold true for the display apparatus 2 ofFIG. 2A. The principle of the fingerprint recognition may be identicallyor similarly applicable to the display apparatus 2 of FIG. 2C.

FIG. 3 illustrates a perspective view showing an application example ofa display apparatus including a fingerprint sensor package according toexemplary embodiments.

Referring to FIG. 3, any of the display apparatuses 1 and 2 may beadopted as a component for a handheld or mobile electronic device, suchas, for example, mobile phone 1000. For example, the mobile phone 1000may include a full front display 1100 with no or minimal bezel. The fullfront display 1100 may include the display apparatus 1 of FIG. 1A or thedisplay apparatus 2 of FIG. 2A or 2C.

When a fingerprint 145 is provided on the full front display 1100, thefingerprint sensor package 100 of FIG. 1A, 2A, or 2C may detect thefingerprint 145. The fingerprint sensor package 100 may be selectivelydisposed on a specific area of the full front display 1100 ordispersedly disposed on the whole area of the full front display 1100.The fingerprint sensor package 100 or the display apparatuses 1 and 2may also be used for other electronic devices such as tablet computers,laptop computers, game devices, automotive electronic devices, andwearable devices.

According to certain disclosed embodiments, the flexible film is mountedthereon not only with the fingerprint sensor, but also with active andpassive devices required for the display apparatus, and thus thefingerprint sensor package may have an effect on achieving thinness andcompactness in size.

Furthermore, since the fingerprint sensor package does not need aflexible printed circuit board, the fingerprint sensor package and thedisplay apparatus including the same may achieve a decrease in thenumber of components, improvement in the degree of design freedom,reduction in cost, thinness and compactness in size, and simplificationin supply chain management of components.

This detailed description should not be construed as limited to theembodiments set forth herein, and it is intended that inventive conceptscover the various combinations, the modifications and variations of thisinvention without departing from the spirit and scope of inventiveconcepts. The appended claims should be construed to include otherembodiments.

1.-40. (canceled)
 41. A fingerprint sensor package, comprising: aflexible film having a top surface and a bottom surface opposite to thetop surface; a fingerprint sensor on the flexible film; and a displaydriver integrated circuit, wherein a portion of the display driverintegrated circuit is mounted on a first end of the flexible film, andwherein the flexible film is partially folded at a portion adjacent tothe first end of the flexible film.
 42. The package of claim 41, whereinthe fingerprint sensor and the display driver integrated circuit aremounted on the top surface of the flexible film.
 43. The package ofclaim 41, wherein the display driver integrated circuit is wire-bondedto the flexible film.
 44. The package of claim 41, further comprising: amain board electrically connected to the fingerprint sensor.
 45. Thepackage of claim 41, further comprising: wherein the fingerprint sensorcomprises an image sensor having a plurality of micro-lenses.
 46. Thepackage of claim 41, further comprising: wherein the fingerprint sensorcomprises pin holes and a plurality of micro-lenses.
 47. The package ofclaim 41, further comprising: a cap overlying the fingerprint sensor; aninfrared cut filter on the cap; and an adhesive layer between the capand the infrared cut filter.
 48. The package of claim 41, furthercomprising: a stiffener on the bottom surface of the flexible film,wherein the stiffener overlaps the fingerprint sensor provided on thetop surface of the flexible film.
 49. A display apparatus, comprising:an organic light emitting diode (OLED) display panel; and a fingerprintsensor package below the OLED display panel, wherein the fingerprintsensor package comprises: a flexible film electrically connected to theOLED display panel, the flexible film having a top surface facing theOLED display panel and a bottom surface opposite to the top surface; afingerprint sensor mounted on the flexible film; a display driverintegrated circuit configured to drive the OLED display panel; and asemiconductor memory device on the top surface of the flexible film,wherein a portion of the display driver integrated circuit is mounted ona first end of the flexible film, and wherein the flexible film ispartially folded at a portion adjacent to the first end of the flexiblefilm.
 50. The apparatus of claim 49, wherein the fingerprint sensor andthe display driver integrated circuit are mounted on the top surface ofthe flexible film.
 51. The apparatus of claim 49, wherein the OLEDdisplay panel comprises an organic layer in which a plurality ofred-colored light emitting layers, a plurality of green-colored lightemitting layers, and a plurality of blue-colored light emitting layersare arrayed.
 52. The apparatus of claim 49, further comprising: anactive device and a passive device that are provided on the top surfaceof the flexible film, wherein the active device comprises asemiconductor memory device, and wherein the passive device comprisesone or more of a capacitor, a resistor, and an inductor.
 53. Theapparatus of claim 49, wherein the display driver integrated circuit isflip-chip bonded to the flexible film.
 54. The apparatus of claim 49,further comprising: wherein the fingerprint sensor comprises an imagesensor having a plurality of micro-lenses.
 55. The apparatus of claim49, further comprising: wherein the fingerprint sensor comprises pinholes and a plurality of micro-lenses.
 56. The apparatus of claim 49,further comprising: a cap overlying the fingerprint sensor; an infraredcut filter on the cap; and an adhesive layer between the cap and theinfrared cut filter.
 57. The apparatus of claim 49, further comprising:a stiffener on the bottom surface of the flexible film, wherein thestiffener overlaps the fingerprint sensor provided on the top surface ofthe flexible film.
 58. A display apparatus, comprising: a display panel;and a fingerprint sensor package below the display panel, wherein thefingerprint sensor package comprises: a flexible film; a fingerprintsensor; a display driver integrated circuit configured to drive thedisplay panel; and active and passive devices, wherein the flexible filmcomprises a top surface facing the display panel and a bottom surfaceopposite to the top surface, wherein a portion of the display driverintegrated circuit is mounted on a first end of the flexible film,wherein the flexible film is partially folded at a portion adjacent tothe first end of the flexible film, and wherein the active and passivedevices are provided on the top surface of the flexible film.
 59. Theapparatus of claim 58, wherein the fingerprint sensor and the displaydriver integrated circuit are mounted on the top surface of the flexiblefilm.
 60. The apparatus of claim 58, further comprising: a cap overlyingthe fingerprint sensor, wherein the cap has an L-shaped cross-sectionthat surrounds a lateral surface of the fingerprint sensor and partiallycovers a top surface of the fingerprint sensor.